SYSTEM INTEGRATION

BOX-BUILD MASTERY

Robust Interconnects (press-fit)

Solderless, high-reliability
Press-fit connections designed for the harshest vibration environments.

Advanced Protection

Targeted Conformal Coating for advanced moisture & chemical protection, combined with Ultrasonic Welding for hermetic sealing of enclosures.

Integrated Sovereighnty

Integrated Sovereignty:
Combining the “Electronic Brain” (SGA) and the “Protective Body” (Odenwald Insulation/ODI) into one turnkey module.

Lead Integrator Advantage

We eliminate interface risks and reduce total cost of ownership by managing the entire mechatronic orchestration.

TECHNICAL HUB

ENGINEERING INTELLIGENCE

The central resource for automotive-grade mechatronics and proprietary lighting technology.

TECHNICAL GLOSSARY

Action-Pin Technology

Gas-tight, solderless mechanical interconnections for extreme vibration environments.

Automated Conformal Coating

High-precision polymeric protection for electronics in harsh outdoor conditions.

Gas-tight, solderless mechanical interconnections for extreme vibration environments.

Full Box-Build Assembly

Complete system integration from PCBA to finished mechatronic product.

Ultrasonic Welding

Hermetic sealing of mechatronic enclosures without thermal stress.

Proprietary Innovation: Aerolite & Eco
Deep dives into our in-house developed street lighting series.

BROWSE PRODUCTS

CAREERS

JOIN THE INTEGRATORS

Become part of the mechatronic revolution in the heart of Europe.

THE INTEGRATOR SPIRIT

We don’t just offer jobs; we offer ownership of complex systems. At SGA, you work where electronics meets high-precision mechanics. We apply automotive rigor to create a sustainable, mechatronic future.

BASED IN SLOVENIA - THE GREEN HEART OF EUROPE

STANDARDS & PROOF

RELIABILITY DASHBOARD

2.0 PPM

Standard

QUALITY EXCELLENCE

Process Security IATF 16949

We apply automotive zero-defect rigor to all industrial and home appliance sectors.

35 %

Equity Ratio

FINANCIAL STABILITY

Total Workforce 420+ Experts

Backed by the professional governance and financial strength of the ECP TacOp Group.

2030 ESG

 

SUSTAINABILITY & ESG ROADMAP

Targeting a 30% CO2 reduction by 2030 and full readiness for the Digital Product Passport (DPP).

Mercedes-Benz
Volkswagen
Hilti
MAN
EvoBus
Magna
Methode Electronics
Grammer
Odelo
Bos
Motherson
Logicdata

CONTACT

ARCHITECTING THE FUTURE TOGETHER

YOUR VISION, INTEGRATED.

Industrijska cesta 12
      3210 Slovenske Konjice,
      Slovenia, Europe

 +386 3 757 16 50

Linkedin

Tell us what you're building.

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    Member of the ECP TacOp Group · Slovenia

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